Slice Engineering Boron Nitride Paste
Slice Engineering Boron Nitride Paste is a high-performance thermal compound designed to maximize heat transfer between your 3D printer's heater block and its cartridges. This specialized paste eliminates air gaps to ensure even heat distribution and improved heater longevity for demanding 3D printing applications.
Key Features
- Enhanced Thermal Transfer: Features a tightly packed crystalline microstructure with a thermal conductivity of 31.4 W/mK at 100°C.
- Electrically Non-Conductive: Unlike standard anti-seize compounds, Boron Nitride is non-conductive, eliminating the risk of short-circuiting heaters or thermistors.
- Release Agent Properties: Facilitates easier removal of heaters and sensors from the block after long-term use at high temperatures.
- Thermal Stability: Engineered for extreme environments, remaining stable up to 850°C in open air.
- Easy Application: Supplied in a syringe with luer lock fittings and an applicator for precise placement inside heat block bores.
Specifications
| Property | Value |
|---|---|
| Volume | 5 cc |
| Thermal Conductivity | 31.4 W/mK at 100°C |
| Max Temp (Air) | 850 °C |
| Max Temp (Vacuum) | 1800 °C |
| Formulation | Aqueous suspension (water-based) |
| Syringe Fitting | Luer Lock |
Usage Instructions
Coat the cartridge heater or thermistor hole in your heat block using the included applicator. Insert the component while the paste is still wet. Once heated, the liquid carrier evaporates, leaving behind a solid, conductive clay-like paste that boosts heat dissipation and improves component life.
Safety
Technical data and Safety Data Sheets (SDS) are available via the Slice Engineering documentation portal. Ensure the paste is dry before reaching maximum operating temperatures to allow for proper outgassing of the aqueous carrier.